Goldman Sachs upgraded Nittobo to Buy in a July 6 report. One key reason was its cautious view on TSMC’s glass core substrate (GCS) progress. I won’t add much commentary here. Just sharing the note. That said, my takeaway is that the other reasons GS cited for the upgrade do not

郭明錤｜Ming-Chi Kuo @mingchikuo ·
Goldman Sachs upgraded Nittobo to Buy in a July 6 report. One key reason was its cautious view on T…

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  1. #1

    MediaTek’s latest announcement on the deepening of its long-term partnership with Nvidia repeatedly uses the term “rack-scale.” This is the key to understanding the announcement,…

    郭明錤｜Ming-Chi Kuo @mingchikuo ·
    MediaTek’s latest announcement on the deepening of its long-term partnership wi…
  2. #2

    聯發科最新公告宣布深化與 Nvidia 的長期合作，其中反覆出現的「rack-scale」，正是理解這份公告的關鍵，也直接驗證了我兩個多月前研究的核心判斷： 聯發科內部已將 AI 事業的策略定位，從「IC / ASIC 設計」提升至「系統級別設計」。 公告網址：

    郭明錤｜Ming-Chi Kuo @mingchikuo ·
    聯發科最新公告宣布深化與 Nvidia 的長期合作，其中反覆出現的「rack-scale」，正是理解這份公告的關鍵，也直接驗證了我兩個多月前研究的核心判斷：…
  3. #3

    Goldman Sachs 在 7 月 6 日發布調升 Nittobo 評等到買進的報告，其中一個核心理由是保守看待台積電的玻璃核心載板（glass core substrate；GCS）發展。我先不多做評論，這邊單純分享訊息。 不過，我的結論是，從該報告其他的調升評等理由看，其實跟未來數年內正向看待 GCS 是不衝突的。

    郭明錤｜Ming-Chi Kuo @mingchikuo ·
    Goldman Sachs 在 7 月 6 日發布調升 Nittobo 評等到買進的報告，其中一個核心理由是保守看待台積電的玻璃核心載板（glass core…
  4. #4

    In this interview, Amazon hardware chief Panos Panay said the company is designing its own end-to-end silicon for some of its devices, while still sourcing chips from external sup…

    郭明錤｜Ming-Chi Kuo @mingchikuo ·
    In this interview, Amazon hardware chief Panos Panay said the company is design…
  5. #5

    在本訪談中，Amazon 硬體主管 Panos Panay 提到該公司正在為部分自家裝置設計自研晶片（end-to-end silicon），且目前仍向其他公司外購晶片（如 Qualcomm）。 這呼應了我先前預測的「Amazon 裝置走向自研晶片」趨勢。另一個重點是，Panay 也提到這是為了裝置端

    郭明錤｜Ming-Chi Kuo @mingchikuo ·
    在本訪談中，Amazon 硬體主管 Panos Panay 提到該公司正在為部分自家裝置設計自研晶片（end-to-end silicon），且目前仍向其他公…
  6. #6

    Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential t…

    郭明錤｜Ming-Chi Kuo @mingchikuo ·
    Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 i…

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