聯發科最新公告宣布深化與 Nvidia 的長期合作,其中反覆出現的「rack-scale」,正是理解這份公告的關鍵,也直接驗證了我兩個多月前研究的核心判斷: 聯發科內部已將 AI 事業的策略定位,從「IC / ASIC 設計」提升至「系統級別設計」。 公告網址:

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    MediaTek’s latest announcement on the deepening of its long-term partnership with Nvidia repeatedly uses the term “rack-scale.” This is the key to understanding the announcement,…

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    Goldman Sachs upgraded Nittobo to Buy in a July 6 report. One key reason was its cautious view on TSMC’s glass core substrate (GCS) progress. I won’t add much commentary here. Jus…

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    Goldman Sachs 在 7 月 6 日發布調升 Nittobo 評等到買進的報告,其中一個核心理由是保守看待台積電的玻璃核心載板(glass core substrate;GCS)發展。我先不多做評論,這邊單純分享訊息。 不過,我的結論是,從該報告其他的調升評等理由看,其實跟未來數年內正向看待 GCS 是不衝突的。

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    In this interview, Amazon hardware chief Panos Panay said the company is designing its own end-to-end silicon for some of its devices, while still sourcing chips from external sup…

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    在本訪談中,Amazon 硬體主管 Panos Panay 提到該公司正在為部分自家裝置設計自研晶片(end-to-end silicon),且目前仍向其他公司外購晶片(如 Qualcomm)。 這呼應了我先前預測的「Amazon 裝置走向自研晶片」趨勢。另一個重點是,Panay 也提到這是為了裝置端

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    Breaking down TSMC's glass core substrate slide On June 11, at JPCA Show 2026 in Japan, TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential t…

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